Using the cloud for semiconductor simulation delivers at least 4X better cost and core-hour efficiency with Ansys 2021 R2.In semiconductors, 2021 R2 provides 3nm-ready Advanced Power Analytics (APA) and improves voltage-drop fixing efficiency by 3X, using aggressor identification, what-if analysis and links to engineering change order (ECO) tools.Ansys Mechanical 2021 R2 streamlines cyclic modal and structural analyses using a new multistage cyclic symmetry capability that can ultimately decrease run times by up to 50X when compared against a full 360 degree solve.Productivity enhancements allow engineers to perform optical simulation meshing up to 20X faster and local meshing up to 100X faster.Speed improvements are woven throughout the latest Ansys products. With access to nearly limitless computing via Ansys Cloud, engineers who use Ansys 2021 R2 products have the speed and flexibility to ask the “what-if” questions that lead to innovations in autonomous vehicles, chip design, mission-critical connectivity solutions and more sustainable travel via lightweight materials and electrification. ![]() ![]() New design ideas can be virtually evaluated in hours, not weeks, freeing up time to optimize the best design candidates or develop moonshot ideas that redefine markets. Ansys' (NASDAQ: ANSS) industry-leading simulation solutions provide an open approach that streamlines engineering via simplified workflows, integrated data management and easy access to high-performance computing (HPC) power via the cloud.Įngineering exploration via simulation is virtually risk free because engineers are no longer bound to an expensive and time-consuming prototype-test-redesign cycle. PITTSBURGH, PA, J– Improvements in Ansys 2021 R2 products provide the power to explore early stage product design and complex system engineering from the nanometer scale of chip design to the mission level of aerospace and defense operating environments.
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